Precision Electroplating Copper Lead Frames for LED Parts Factory

Overview:

Precision Electroplated Copper Lead Frames for LED applications are engineered for superior electrical and thermal conductivity. Made from high-purity copper alloys, these components feature micron-level precision through advanced photochemical etching, supporting complex, custom designs for modern LED modules.

Available with silver, nickel, or gold plating, they offer enhanced corrosion resistance, solderability, and contact reliability. Our factory provides OEM and fully customized solutions, including tailored dimensions, geometries, and finishes. Ideal for high-power and micro-LED systems, these lead frames deliver consistent, scalable performance with rapid prototyping support.

Features:

Place of Origin: Xiamen, China

Brand Name: OEM

Material: Copper

Application: Electrical

Service: Customized OEM solutions

Surface Treatment: Available upon request

Size: Customized dimensions available

Tolerance: ±0.1 mm

MOQ: Small orders accepted

Color: Custom colors available

Sample: Available for approval

Certifications: ISO, IATF

Benefit of Our Lead Frame:

1. Enhanced Conductivity & Signal Integrity

– Uniform copper electroplating (3–10µm) and annealing in inert atmospheres optimize electrical conductivity (≤20 μΩ·cm), ensuring stable current distribution for high-power LED performance.

2. Superior Corrosion Resistance

– Precision-controlled passivation (benzotriazole coatings) and ASTM B117-compliant salt spray testing guarantee long-term durability in humid or chemically aggressive environments.

3. Tight Dimensional Accuracy

– Servo-driven stamping (±0.01mm tolerance) paired with laser profilometry ensures flawless fitment for miniaturized LED packaging and automated SMT assembly processes.

4. High Thermal & Mechanical Reliability

– Stress-relief annealing (300–400°C) and adhesion testing (ASTM D3359) prevent delamination or warping under thermal cycling (up to 150°C), extending LED lifespan in automotive/industrial applications.

Production Process:

1. Material Preparation

– Start with high-purity copper alloy strips (e.g., C194/C7025) cleaned via alkaline degreasing and acid pickling to remove oxides.

2. Precision Stamping

– Use servo-driven stamping presses to blank and form lead frames with tight tolerances (±0.01mm).

3. Surface Activation

– Immerse in micro-etch baths (sulfuric acid/H₂O₂) to enhance adhesion for electroplating.

4. Electroplating

– Apply uniform copper plating (3–10µm) in automated continuous electroplating lines with controlled current density (10–30 ASD) and bath chemistry (CuSO₄-based).

5. Post-Plating Treatment

– Passivate with anti-tarnish coatings (benzotriazole) to prevent oxidation.

6. Annealing

– Heat-treat in inert atmosphere furnaces (300–400°C) to relieve stress and improve conductivity.

7. Quality Inspection

– Validate thickness via XRF spectroscopy, adhesion (tape test), and surface roughness (profilometry). Salt spray testing (ASTM B117) ensures corrosion resistance.

Factory Show:

Our state-of-the-art facility harnesses cutting-edge manufacturing technologies—including 25 high-performance punch presses (25–300 tons), precision wire EDM machines, advanced grinding centers, and dedicated welding, polishing, and ultrasonic-cleaning stations—to achieve exceptional surface finishes and rigorous cleanliness standards. Complementing our stamping expertise, we offer a full suite of metal-plating solutions (electroplating, zinc, nickel, chrome, and anodizing) that deliver uniform, industry-compliant corrosion protection. With fully automated production lines and stringent quality-control protocols backed by ISO 9001 and IATF 16949 certifications, we ensure unparalleled precision, reliability, and durability throughout every stage of our metal-stamping processes.